Research Article
Effect of Plasma Cleaning Process in the Wettability of Flip Chip PBGA Substrate of Integrated Circuit Packages
Department of Electrical, Electronic and System Engineering, National University of Malaysia, Bangi, 43600 Selangor, Malaysia
A.Y. Cheah
Department of Electrical, Electronic and System Engineering, National University of Malaysia, Bangi, 43600 Selangor, Malaysia
I. Ahmad
Department of Electronics and Communication, College of Engineering, Universiti Tenaga Nasional, Kajang 43009, Selangor, Malaysia