Ge Fen
Science and Technology on Avionics Integration Laboratory, Shanghai, 200233, China
Feng Gui
College of Electronic and Information Engineering, Nanjing University of Aero. and Astro., Nanjing, Jiangsu, 210016, China
Yu Shuang
College of Electronic and Information Engineering, Nanjing University of Aero. and Astro., Nanjing, Jiangsu, 210016, China
Wu Ning
College of Electronic and Information Engineering, Nanjing University of Aero. and Astro., Nanjing, Jiangsu, 210016, China
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How to cite this article
Ge Fen, Feng Gui, Yu Shuang and Wu Ning, 2013. Power-and Thermal-aware Mapping for 3D Network-on-chip. Information Technology Journal, 12: 7297-7304.
DOI: 10.3923/itj.2013.7297.7304
URL: https://scialert.net/abstract/?doi=itj.2013.7297.7304
DOI: 10.3923/itj.2013.7297.7304
URL: https://scialert.net/abstract/?doi=itj.2013.7297.7304