Kailin Pan
School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, No. 1, Jinji Road, Guilin, 541004, China
Yu Guo
School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, No. 1, Jinji Road, Guilin, 541004, China
Guotao Ren
School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, No. 1, Jinji Road, Guilin, 541004, China
Hua Lin
School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, No. 1, Jinji Road, Guilin, 541004, China
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How to cite this article
Kailin Pan, Yu Guo, Guotao Ren and Hua Lin, 2014. Heat Dissipation and Thermo-mechanical Reliability Study for Multi-chip Module High Power LED Integrated Packaging with Through Silicon Vias. Information Technology Journal, 13: 1316-1322.
DOI: 10.3923/itj.2014.1316.1322
URL: https://scialert.net/abstract/?doi=itj.2014.1316.1322
DOI: 10.3923/itj.2014.1316.1322
URL: https://scialert.net/abstract/?doi=itj.2014.1316.1322