Xu Yue-zeng
Zhejian Gtongji Vocational College of Science And Technology, Hangzhou, 311231, China
Yong Dai
Zhejiang University of Technology, Hangzhou, 310032, China
Jiang Fan
Zhejian Gtongji Vocational College of Science And Technology, Hangzhou, 311231, China
ABSTRACT
In order to reduce cutting depth differences caused by free abrasive grain size range and enhance accuracy with efficiency, a new efficient and high precision nondestructive processes method that based on multi-elastic unit plate was mentioned. Meantime, mechanism of this plate was studied and cutting depths model of single abrasive used to simulate the processes of lapping was established. Experiment processes and simulation results of lapping between multi-elastic unit plate and traditional eternity plate were compared. It was found that lapping processes based on multi-elastic unit plate can ensure the working efficiency and highly improve machining accuracy. It was verified that cutting depths model of multi-elastic unit plate and simulation results can be applied to choose the parameters of lapping processes based on multi-elastic unit plate.
PDF References Citation
How to cite this article
Xu Yue-zeng, Yong Dai and Jiang Fan, 2013. Study on the Lapping Processes Based on Multi-elastic Unit Plate. Information Technology Journal, 12: 5993-5998.
DOI: 10.3923/itj.2013.5993.5998
URL: https://scialert.net/abstract/?doi=itj.2013.5993.5998
DOI: 10.3923/itj.2013.5993.5998
URL: https://scialert.net/abstract/?doi=itj.2013.5993.5998
REFERENCES
- Deshpande, L.S., S. Raman, O. Sunanta and C. Agbaraji, 2008. Observations in the flat lapping of stainless steel and bronze. Wear, 265: 105-116.
CrossRefDirect Link - Yuan, J.L., B.H. Lv, Z.Z. Zhou and B.C. Tao, 2006. Parameters optimization on the lapping process for advanced ceramics by applying Taguchi method. Mater. Sci. Forum, 532-533: 488-491.
CrossRefDirect Link - Zeng, Z.G., J.M. Deng and W.H. Jiang, 2002. Finite element analysis for active polishing lap. High Power Laser Particle Beams, 14: 29-34.
Direct Link